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'Chips For Viksit Bharat': PM Modi Lays Foundation Stone Of Three Semiconductor Facilities Worth Rs 1.25 Lakh Crore

Kuldeep NegiMar 13, 2024, 11:05 AM | Updated 10:05 AM IST
Semiconductor chip

Semiconductor chip


Prime Minister Narendra Modi on Wednesday (13 March) virtually laid the foundation stone of three semiconductor projects worth about Rs 1.25 lakh crore during the  ‘India’s Techade: Chips for Viksit Bharat’ event.

The foundation stone is being laid for the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam; and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat.

The Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL)  under the Modified Scheme for setting up of Semiconductor Fabs in India.


The Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 27,000 crore.

The Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, will be set up by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 7,500 crore.

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