News Brief
Tata Ramps Up Semiconductor Workforce With Taiwan Training As Dholera and Assam Units Gear Up For Launch: Report
Tata Electronics
Tata Electronics is sending large batches of employees to Taiwan for hands-on training, a move tied to the company’s forthcoming semiconductor fabrication (fab) plant in Dholera, Gujarat and its OSAT (Outsourced Semiconductor Assembly and Test) facility in Assam.
According to a Economic Times report, “a couple of hundred” employees have already been sent to Powerchip Semiconductor Manufacturing Corporation (PSMC), the company's technology partner, to acquire the specialised skills required for fab operations.
“The number of people going in for training to Taiwan from Tata Electronics has certainly gone up as the company gets closer and is preparing for its fab,” a person aware of the developments was quoted as saying by ET.
Given PSMC’s limited training capacity, Tata is adopting a staggered and structured approach.
“About 50 to 75 people are being sent at one go. It's a very methodical, thoughtful process,” the person added.
Tata is reportedly hiring people in batches of around 75 people based on different funcitons such as equipment, yield engineering, process technology, and quality engineering.
The Assam unit’s first phase is slated for launch by mid-2025, and Union Minister Ashwani Vaishnaw has stated that Dholera's first chip will be ready by December 2026.
The company is aggressively expanding its talent pool, hiring both fresh graduates and experienced professionals, and recently appointed Tim McIntosh from Intel as Vice President and Head of Operations and Manufacturing Excellence at Tata Semiconductor Assembly and Test (TSAT).
Former GlobalFoundries Asia President KC Ang has also joined as President and Head of Tata Semiconductor Manufacturing.
Tata may additionally acquire a Malaysian chip plant to build operational expertise.
The Dholera fab, supported by PSMC, will boast AI-enabled, data-driven automation and a capacity of 50,000 wafers per month, producing chips for applications across AI, automotive, computing, and wireless communications.
