News Brief
Semiconductor chips (Representative image)
US President Joe Biden and Prime Minister Narendra Modi on Saturday (21 September) hailed a watershed arrangement to establish a new advanced semiconductor fabrication plant.
The chip manufacturing plant will be focused on advanced sensing, communication, and power electronics for national security, next generation telecommunications, and green energy applications.
The fab will be established with the objective of manufacturing infrared, gallium nitride and silicon carbide semiconductors.
The chip plant will be built with the support from India Semiconductor Mission as well as a strategic technology partnership between Bharat Semi, 3rdiTech, and the US Space Force.
The facility in Kolkata will enhance mutually beneficial linkages in research and development in chip manufacturing and enable game-changing advances for zero and low emission as well as connected vehicles, internet of things devices, AI, and data centers, according to a Joint Fact Sheet released by the White House after the meeting of PM Modi and President Biden in Delaware.
The two leaders also welcomed the launch of a new U.S.-India Advanced Materials R&D Forum to expand collaboration between American and Indian universities, national laboratories, and private sector researchers.