“We Are Designing 2nm Chips In India,” Says Union Minister Ashwini Vaishnaw

Union Minister Ashwini Vaishnaw showcased a palm-sized model of a homegrown semiconductor wafer at the NDTV World Summit in Delhi today (18 October), highlighting India's ambitions in advanced chip manufacturing.

The minister emphasised that the wafer has the potential to disrupt global market leaders in the semiconductor industry as India gears up to design two-nanometers chips.

Speaking at the summit, Vaishnaw outlined India's digital-led growth story, pointing to initiatives including digital credit, fast mobile data and large language models (LLMs) as key drivers of technological transformation.

India has approved 10 semiconductor projects with total investment of Rs 1. 6 lakh crore across six states, marking a decisive push towards semiconductor self-reliance.

The two-nanometers chip technology represents a significant leap in India's semiconductor capabilities.

British semiconductor firm ARM will develop cutting-edge 2nm chips from its Bengaluru office, which Vaishnaw inaugurated last month.

These advanced chips will offer better performance and power efficiency due to their smaller transistor size and will be used in artificial intelligence servers, drones and mobile phones.

"We have a very significant talent base that has given us a unique strength. Already 20 per cent of our design engineers, global design engineering talent is in India. And today we are designing chips of 2 nanometers in our country," he said.

India's semiconductor ecosystem has grown rapidly since the launch of the India Semiconductor Mission in December 2021 with an outlay of Rs 76,000 crore.

The country expects to roll out its first Made-in-India semiconductor chip by the end of 2025, with five manufacturing units currently under construction.

The government has also launched initiatives to train 85,000 engineers in advanced semiconductor and electronics manufacturing.

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