India Approves Four New Semiconductor Projects Worth Rs 4,600 Crore, Expanding National Chip-Making Footprint

With six semiconductor projects already in progress under the India Semiconductor Mission (ISM), the Union Cabinet on Tuesday (12 August) has cleared an additional four initiatives.

These will be undertaken by SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies, the press statement informed.

They mark important steps in India’s chip-making journey, including the nation’s first commercial compound semiconductor fabrication plant and a cutting-edge glass substrate packaging unit.

Both are expected to complement India’s fast-growing chip design ecosystem.

The combined investment for these four projects is pegged at approximately Rs 4,600 crore. They are projected to create 2,034 high-skilled jobs along with numerous indirect employment opportunities.

With these additions, ISM now has 10 approved projects spread over six states, attracting total investments worth Rs 1.60 lakh crore.

Company Overviews and Manufacturing Plans

1. SiCSem Private Ltd

In collaboration with UK-based Clas-SiC Wafer Fab Ltd., SiCSem will set up India’s first commercial silicon carbide (SiC) compound semiconductor fabrication plant in Info Valley, Bhubaneswar.

The plant will produce 60,000 wafers annually and package 96 million units for sectors such as defence, electric vehicles, rail transport, data centres, and solar energy.

2. 3D Glass Solutions Inc.

Also in Info Valley, Bhubaneswar 3D Glass Solutions will establish an advanced packaging and embedded glass substrate facility.

With capabilities including glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules, the site will produce 69,600 glass substrates, 50 million assembled units, and 13,200 3DHI modules yearly. Applications span AI, defence, automotive, and photonics.

3. Advanced System in Package Technologies (ASIP)

ASIP will build a manufacturing unit in Andhra Pradesh, partnering with South Korea’s APACT Co. Ltd. The plant will produce 96 million units annually for mobile, automotive, and consumer electronics markets.

4. Continental Device India Ltd (CDIL)

CDIL will expand its Mohali, Punjab facility to produce 158.38 million units annually, including MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors. The devices will support EV infrastructure, renewable energy, industrial systems, and telecommunications.

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