India's Semiconductor Push: New HCL-Foxconn Fab In UP's Noida Gets Union Cabinet Nod, To Produce 36 Million Chips Monthly

The Union Cabinet, chaired by Prime Minister Narendra Modi, has cleared the establishment of a new semiconductor unit in UP's Noida— the country’s sixth such facility under the India Semiconductor Mission—in a significant step to scale up domestic chip manufacturing.

The newly approved unit is a joint venture between Indian tech major HCL and Taiwanese electronics giant Foxconn.

The facility will be located near the upcoming Jewar International Airport in the Yamuna Expressway Industrial Development Authority (YEIDA) region in Uttar Pradesh.

The plant will manufacture display driver chips for mobile phones, laptops, automobiles, PCs, and other consumer devices.

The facility is designed to process 20,000 wafers per month, with a target production output of 36 million chips monthly.

This project alone is expected to attract an investment of Rs 3,700 crore.

The semiconductor ecosystem in India is also expanding as global equipment giants such as Applied Materials and Lam Research have established their presence in the country, while chemical and gas suppliers like Merck, Linde, Air Liquide, and Inox are scaling up to support the demand from fabs.

With this sixth fab, India is solidifying its push into the semiconductor space—now widely recognized as a critical, strategic sector globally.

"Already five semiconductor units are in advanced stages of construction.  With this sixth unit, Bharat moves forward in its journey to develop the strategically vital semiconductor industry," the government said in a statement.

Also Read: ‘Bhargavastra’: India’s New Low-Cost Drone Swarm Killer Successfully Conducts Salvo, Single-Rocket Trials