RRP Electronics Partners With Global Firms For Setting Up Semiconductor Fab, OSAT Facilities In Maharashtra

RRP Electronics has announced plans to build a Rs 24,000 crore semiconductor fabrication unit and a Rs 12,035 crore phase 1 outsourced semiconductor assembly test (OSAT facility) in Maharashtra in collaboration with HMT Zurich, AMB Taiwan, and US-based Deca Technologies, Economic Times reported.

According to the company, the initiative is backed by the Maharashtra government.

The company is investing in a large-scale technology transfer licence agreement (TTLA) with Deca Technologies, which is also into advanced semiconductor packaging.

Deca Technologies is backed by leading industry players, including Qualcomm, Infineon, and ASE Group.

The company expects completing its qualification tests by August this year and also expects revenue to exceed Rs 260 crore. This is their second year of operations.

“We are partnering with HMT Zurich, AMB Taiwan and more recently US-based Deca Technologies. We are investing in a TTLA with Deca Technologies, a leader in advanced semiconductor packaging with backing from industry giants like Qualcomm, Infineon and ASE Group," Rajendra K Chodankar, chairperson and chief executive of RRP Electronics was quoted as saying by ET.

“This partnership will take semiconductor packaging in India to new heights. We aim to complete our qualification tests by August 2025 and foresee revenue exceeding USD 30 million (about Rs 260 crore) in just the second year of operations, with exponential growth in the years to come," he added.

At present, RRP Electronics is collaborating on a high-profile project for a Swiss customer, focused on the production of sophisticated ASICs in QFN packages.

Also Read: