MediaTek Develops First Chip Using TSMC's 3nm Process, Set For Volume Production In 2024

Taiwanese fabless semiconductor firm Mediatek on Thursday (7 September) announced that it has successfully developed its first chip using TSMC’s leading-edge 3nm technology.

The company said that the volume production of the Dimensity system-on-chip (SoC) using TSMC's 3nm process is expected to begin next year.

"MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024," the company said in a statement.

TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high performance computing and mobile applications.

Compared with TSMC’s N5 process, TSMC’s 3nm technology currently offers as much as 18 per cent speed improvement at same power, or 32 per cent power reduction at same speed, and approximately 60 per cent increase in logic density, the company said.

Commenting on the development, MediaTek president Joe Chen said, “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market".

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Cliff Hou, senior vice president of Europe and Asia sales at TSMC.